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| Z86E0812SSC资料 | |
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Z86E0812SSC PDF Download |
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File Size : 116 KB
Manufacturer:ZIOLG Description:(1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of 125C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125C for best performance and long term reliability. (3) The THS4271/5 may incorporate a PowerPAD on the underside of the chip. This acts as a heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：Z86E0812SSC 厂 家：ZIOLG 封 装：SOP18 批 号：07+ 数 量：530 说 明：100%真实库存，原装，部分现货 |
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运 费： 所在地：深圳 新旧程度： |
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| 联系人：陈小姐 |
| 电 话：0755-83605789 |
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