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SAA7391HL资料 | |
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SAA7391HL PDF Download |
File Size : 116 KB
Manufacturer:PHILIPS Description:The THS4513 incorporates a (QFN) exposed thermal pad on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the QFN thermally enhanced package. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:SAA7391HL 厂 家:PHILIPS 封 装:TQFP144 批 号:08+ 数 量:2000 说 明:绝对原厂原装现货热卖!! |
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运 费: 所在地:深圳 新旧程度: |
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