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| RTC63423资料 | |
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RTC63423 PDF Download |
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File Size : 116 KB
Manufacturer:RTC Description:On the SO-8 package the four ground pins are thermally connected to the backside of the die. Adding approximately 0.04 square inches of 2 oz. copper pad area to these four pins will improve the JA rating to approximately 110˚C/W. If this extra pad are is placed directly beneath the package there should not be any impact on board density. On the TO-252 package the ground tab is thermally con- nected to the backside of the die. Adding 1 square inch of 2 oz. copper pad area directly under the ground tab will im- prove the JA rating to approximately 50˚C/W. While the LM2936 has an internally set thermal shutdown point of typically 150˚C, this is intended as a safety feature only. Continuous operation near the thermal shutdown tem- perature should be avoided as it may have a negative affect on the life of the device. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：RTC63423 厂 家：RTC 封 装：SOP 批 号：07+ 数 量：850 说 明：100%真实库存，原装，部分现货 |
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运 费： 所在地：深圳 新旧程度： |
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| 联系人：陈小姐 |
| 电 话：0755-83605789 |
| 手 机：13428979109 |
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| 公司地址： 广东深圳市福田区华强北（振华路）赛格高科德电子市场A1848室 |
