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| MIC4423BWM资料 | |
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MIC4423BWM PDF Download |
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File Size : 116 KB
Manufacturer:MICREL Description:The THS4513 incorporates a (QFN) exposed thermal pad on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the QFN thermally enhanced package. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MIC4423BWM 厂 家：MICREL 封 装：SOP-16 批 号：07+ 数 量：2700 说 明：100%真实库存，原装，部分现货 |
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运 费： 所在地：深圳 新旧程度： |
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| 联系人：陈小姐 |
| 电 话：0755-83605789 |
| 手 机：13428979109 |
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| 公司地址： 广东深圳市福田区华强北（振华路）赛格高科德电子市场A1848室 |
