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MAX3233ECWP

MAX3233ECWP资料
MAX3233ECWP
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File Size : 116 KB
Manufacturer:MAXIM
Description:The Smart 3 Advanced Boot Block, manufactured on Intels latest 0.25 µ technology, represents a feature- rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40- lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intels WWW page: http://www.intel.com/design/flash.
 
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型 号:MAX3233ECWP
厂 家:MAXIM
封 装:SOP
批 号:07+
数 量:2650
说 明:100%真实库存,原装,部分现货
 
 
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所在地:深圳
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公司地址: 广东深圳市福田区华强北(振华路)赛格高科德电子市场A1848室
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