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| MAX3233ECWP资料 | |
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MAX3233ECWP PDF Download |
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File Size : 116 KB
Manufacturer:MAXIM Description:The Smart 3 Advanced Boot Block, manufactured on Intels latest 0.25 µ technology, represents a feature- rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40- lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intels WWW page: http://www.intel.com/design/flash. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号:MAX3233ECWP 厂 家:MAXIM 封 装:SOP 批 号:07+ 数 量:2650 说 明:100%真实库存,原装,部分现货 |
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运 费: 所在地:深圳 新旧程度: |
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| 联系人:陈小姐 |
| 电 话:0755-83605789 |
| 手 机:13428979109 |
| QQ:656259901,307704921 |
| MSN:chenqiongxia18@126.com |
| 传 真:0755-23816523 |
| EMail:656259901@qq.com |
| 公司地址: 广东深圳市福田区华强北(振华路)赛格高科德电子市场A1848室 |