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ES2898S资料 | |
ES2898S PDF Download |
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File Size : 116 KB
Manufacturer:ESS Description:away from the substrate during the bonding process due to the deformation of the beam by the bonding tool. This effect is beneficial as it provides stress relief for the diode during thermal cycling of the substrate. The coefficient of expansion of some substrate materials, specifically soft substrates, is such that some bugging is essential if the circuit is to be operated over wide tempera- ture extremes. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:ES2898S 厂 家:ESS 封 装:QFP 批 号:07+ 数 量:1200 说 明:100%真实库存,原装,部分现货 |
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运 费: 所在地:深圳 新旧程度: |
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